| 1. | Olga organic land grid array
有机平面网阵包装 |
| 2. | Olga organic land grid array
基板栅格阵列 |
| 3. | Lga land grid array
接点栅格阵列 |
| 4. | Land grid array
连接盘网格阵列 |
| 5. | Flga . mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch land grid array - rectangular type
半导体装置的机械标准化.表面安装的半导体器件封装图形图绘制的一般规则.细微间距栅级阵列 |
| 6. | Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array
半导体器件的机械标准化.第6 - 6部分:平面式安装半导体器件外壳外形图绘制的一般规则.小螺距刃片栅格排列的设计指南 |
| 7. | Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array
半导体器件的机械标准化.第6 - 6部分:半导体器件包装用表面安装略图制备的一般规则.小螺距刃片栅格排列的设计指南 |
| 8. | Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type
半导体器件的机械标准化.第6 - 12部分:表面安装半导体器件封装外形图绘制的一般规则.小节距栅极矩阵列的设计指南 |
| 9. | Flag . mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array - proposed amendment on terminology
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小爆距纹间表面网格阵列 |
